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A Numerical Investigation of the Gap Effect on the Condensation Heat Transfer in Vertical Mini-Channels with Various Wettability Conditions
A Numerical Investigation of the Gap Effect on the Condensation Heat Transfer in Vertical Mini-Channels with Various Wettability Conditions
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Conference Proceeding 		Add to e-Shelf

A Numerical Investigation of the Gap Effect on the Condensation Heat Transfer in Vertical Mini-Channels with Various Wettability Conditions

Son, Hyo Je ; Lee, Hanchoon ; Yang, Jae Sung ; Jung, Seungmo ; Ha, Man Yeong ; Min, June Kee

ASHRAE transactions, 2022, Vol.128 (1), p.50-58 [Peer Reviewed Journal]

Atlanta: American Society of Heating, Refrigerating, and Air-Conditioning Engineers, Inc. (ASHRAE)

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2
Comments on electromigration analysis methods
Comments on electromigration analysis methods
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Conference Proceeding 		Add to e-Shelf

Comments on electromigration analysis methods

Zhu, X. ; Kotadia, H. ; Xu, S. ; Lu, H. ; Mannan, S. H. ; Bailey, C. ; Chan, Y. C.

2013 14th International Conference on Electronic Packaging Technology, 2013, p.529-534

IEEE

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3
Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects
Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects
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Intrinsic study of current crowding and current density gradient effects on electromigration in BEOL copper interconnects

Croes, K. ; Li, Y. ; Lofrano, M. ; Wilson, C. J. ; Tokei, Z.

2013 IEEE International Reliability Physics Symposium (IRPS), 2013, p.2C.3.1-2C.3.4

IEEE

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4
Damage of SAC405 solder joint under PDC
Damage of SAC405 solder joint under PDC
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Conference Proceeding 		Add to e-Shelf

Damage of SAC405 solder joint under PDC

Wei Yao ; Basaran, C.

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.403-407

IEEE

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5
Review of Joule heating in graphene nano-ribbon
Review of Joule heating in graphene nano-ribbon
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Conference Proceeding 		Add to e-Shelf

Review of Joule heating in graphene nano-ribbon

Yanbiao Chu ; Basaran, C.

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.7-9

IEEE

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6
Mean time to failure of SnAgCuNi solder joints under DC
Mean time to failure of SnAgCuNi solder joints under DC
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Conference Proceeding 		Add to e-Shelf

Mean time to failure of SnAgCuNi solder joints under DC

Basaran, Cemal ; Shidong Li ; Hopkins, D. C. ; Wei Yao

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.518-520

IEEE

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7
Solder joint grain boundary structure and diffusivity via molecular dynamics simulations
Solder joint grain boundary structure and diffusivity via molecular dynamics simulations
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Conference Proceeding 		Add to e-Shelf

Solder joint grain boundary structure and diffusivity via molecular dynamics simulations

Basaran, C. ; Sellers, M. S. ; Schultz, A. J. ; Kofke, D. A. ; Yongchang Lee

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.514-517

IEEE

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8
Modeling Joule heating in carbon nanotubes with Monte Carlo simulations
Modeling Joule heating in carbon nanotubes with Monte Carlo simulations
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Conference Proceeding 		Add to e-Shelf

Modeling Joule heating in carbon nanotubes with Monte Carlo simulations

Ragab, Tarek ; Basaran, Cemal

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.20-29

IEEE

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9
Skin effect and material degradation of lead-free solder joint under AC
Skin effect and material degradation of lead-free solder joint under AC
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Conference Proceeding 		Add to e-Shelf

Skin effect and material degradation of lead-free solder joint under AC

Yao Wei ; Cemal, B.

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.408-412

IEEE

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10
A velocity averaging method for bridging molecular dynamics with finite element analysis
A velocity averaging method for bridging molecular dynamics with finite element analysis
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Conference Proceeding 		Add to e-Shelf

A velocity averaging method for bridging molecular dynamics with finite element analysis

Yongchang Lee ; Basaran, C.

13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, 2012, p.399-402

IEEE

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