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An illustrative equivalence theorem example
An illustrative equivalence theorem example
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An illustrative equivalence theorem example

Booysen, R.

IEEE antennas & propagation magazine, 2000-12, Vol.42 (6), p.132-135

New York, NY: IEEE

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2
Lorenz, Lorentz, and the gauge
Lorenz, Lorentz, and the gauge
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magazinearticle 		Adicionar ao Meu Espaço

Lorenz, Lorentz, and the gauge

Nevels, R. ; Chang-Seok Shin

IEEE antennas & propagation magazine, 2001-06, Vol.43 (3), p.70-71

New York, NY: IEEE

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3
Dyadic Green's Functions for an Anisotropic, Non-Local Model of Biased Graphene
Dyadic Green's Functions for an Anisotropic, Non-Local Model of Biased Graphene
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Dyadic Green's Functions for an Anisotropic, Non-Local Model of Biased Graphene

Hanson, G.W.

IEEE transactions on antennas and propagation, 2008-03, Vol.56 (3), p.747-757 [Periódico revisado por pares]

New York, NY: IEEE

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4
A New 3-D Transmission Line Matrix Scheme for the Combined SchrÖdinger-Maxwell Problem in the Electronic/Electromagnetic Characterization of Nanodevices
A New 3-D Transmission Line Matrix Scheme for the Combined SchrÖdinger-Maxwell Problem in the Electronic/Electromagnetic Characterization of Nanodevices
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A New 3-D Transmission Line Matrix Scheme for the Combined SchrÖdinger-Maxwell Problem in the Electronic/Electromagnetic Characterization of Nanodevices

Pierantoni, L. ; Mencarelli, D. ; Rozzi, T.

IEEE transactions on microwave theory and techniques, 2008-03, Vol.56 (3), p.654-662 [Periódico revisado por pares]

New York, NY: IEEE

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5
A New Look at Reciprocity and Energy Conservation Theorems in Electromagnetics
A New Look at Reciprocity and Energy Conservation Theorems in Electromagnetics
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A New Look at Reciprocity and Energy Conservation Theorems in Electromagnetics

Chew, Wen Cho

IEEE transactions on antennas and propagation, 2008-04, Vol.56 (4), p.970-975 [Periódico revisado por pares]

New York, NY: IEEE

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6
On "Maximum Power Available to Stress Onto the Critical Component in the Equipment Under Test When Performing a Radiated Susceptibility Test in the Reverberation Chamber"
On "Maximum Power Available to Stress Onto the Critical Component in the Equipment Under Test When Performing a Radiated Susceptibility Test in the Reverberation Chamber"
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On "Maximum Power Available to Stress Onto the Critical Component in the Equipment Under Test When Performing a Radiated Susceptibility Test in the Reverberation Chamber"

Hoijer, M. ; Krauthauser, H.G. ; Ladbury, J.

IEEE transactions on electromagnetic compatibility, 2008-11, Vol.50 (4), p.1020-1020 [Periódico revisado por pares]

New York, NY: IEEE

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7
Uniaxial IB-Medium Interface and Novel Boundary Conditions
Uniaxial IB-Medium Interface and Novel Boundary Conditions
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Uniaxial IB-Medium Interface and Novel Boundary Conditions

Lindell, I.V. ; Sihvola, A.H.

IEEE transactions on antennas and propagation, 2009-03, Vol.57 (3), p.694-700 [Periódico revisado por pares]

New York, NY: IEEE

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8
Zero Backscattering From Self-Dual Objects of Finite Size
Zero Backscattering From Self-Dual Objects of Finite Size
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Zero Backscattering From Self-Dual Objects of Finite Size

Lindell, I.V. ; Sihvola, A. ; Yla-Oijala, P. ; Wallen, H.

IEEE transactions on antennas and propagation, 2009-09, Vol.57 (9), p.2725-2731 [Periódico revisado por pares]

New York, NY: IEEE

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9
Deriving Electromagnetic Fields From the Spinor Solution of the Massless Dirac Equation
Deriving Electromagnetic Fields From the Spinor Solution of the Massless Dirac Equation
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Deriving Electromagnetic Fields From the Spinor Solution of the Massless Dirac Equation

Rozzi, T. ; Mencarelli, D. ; Pierantoni, L.

IEEE transactions on microwave theory and techniques, 2009-12, Vol.57 (12), p.2907-2913 [Periódico revisado por pares]

New York, NY: IEEE

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10
Derivation of Lichtenecker's Logarithmic Mixture Formula From Maxwell's Equations
Derivation of Lichtenecker's Logarithmic Mixture Formula From Maxwell's Equations
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Derivation of Lichtenecker's Logarithmic Mixture Formula From Maxwell's Equations

Simpkin, R.

IEEE transactions on microwave theory and techniques, 2010-03, Vol.58 (3), p.545-550 [Periódico revisado por pares]

New York, NY: IEEE

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