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Refinado por: assunto: Embedded Electronics remover
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1
Robotics 4.0: Performance improvement made easy
Material Type:
Ata de Congresso
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Robotics 4.0: Performance improvement made easy

Bonci, Andrea ; Pirani, Massimiliano ; Longhi, Sauro

2017 22nd IEEE International Conference on Emerging Technologies and Factory Automation (ETFA), 2017, p.1-8

IEEE

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2
Laser Additive Manufacturing of Embedded Electronics
Material Type:
Capítulo de Livro
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Laser Additive Manufacturing of Embedded Electronics

Brandt Milan

Laser Additive Manufacturing - Materials, Design, Technologies, and Applications, 2017, p.2-2

Elsevier

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3
Mechanical Safety of Embedded Electronics for In-body Wearables: A Smart Mouthguard Study
Material Type:
Artigo
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Mechanical Safety of Embedded Electronics for In-body Wearables: A Smart Mouthguard Study

Bridgman, Helen ; Kwong, Man Ting ; Bergmann, Jeroen H. M.

Annals of biomedical engineering, 2019-08, Vol.47 (8), p.1725-1737 [Periódico revisado por pares]

New York: Springer US

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4
Embedded electronics for a 64-channel wireless brain implant
Material Type:
Ata de Congresso
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Embedded electronics for a 64-channel wireless brain implant

BURGERT, Johann ; MALASEK, Jan ; MARTEL, Sylvain ; WISEMAN, Colette ; FOFONOFF, Tim ; DYER, Robert ; HUNTER, Ian ; HATSOPOULOS, Nicholas ; DONOGHUE, John

SPIE proceedings series, 2001, p.124-134

Bellingham WA: SPIE

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5
An event-driven low power electronics for loads metering and control in smart buildings
Material Type:
Ata de Congresso
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An event-driven low power electronics for loads metering and control in smart buildings

Conus, Gilbert ; Lilis, Georgios ; Zanjani, Nastaran Asadi ; Kayal, Maher

2016 Second International Conference on Event-based Control, Communication, and Signal Processing (EBCCSP), 2016, p.1-7

IEEE

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6
Features and Always-On Wake-Up Detectors for Sparse Acoustic Event Detection
Material Type:
Artigo
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Features and Always-On Wake-Up Detectors for Sparse Acoustic Event Detection

Gazivoda, Marko ; Oletić, Dinko ; Bilas, Vedran

Electronics (Basel), 2022-02, Vol.11 (3), p.478 [Periódico revisado por pares]

Basel: MDPI AG

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7
Glass Fiber‐Reinforced Polyurethane Composite Structures with Integrated Piezoelectric Sensor Elements and Corresponding Electronics
Material Type:
Artigo
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Glass Fiber‐Reinforced Polyurethane Composite Structures with Integrated Piezoelectric Sensor Elements and Corresponding Electronics

Geller, Sirko ; Tyczynski, Thomas ; Gude, Maik ; Sauer, Sebastian ; Fischer, Wolf‐Joachim

Advanced engineering materials, 2018-12, Vol.20 (12), p.n/a [Periódico revisado por pares]

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8
Additively manufactured multi-material free-form structure with printed electronics
Material Type:
Artigo
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Additively manufactured multi-material free-form structure with printed electronics

Goh, Guo Liang ; Agarwala, Shweta ; Goh, Guo Dong ; Tan, Heang Kuan Joel ; Zhao, Liping ; Chuah, Tong Kuan ; Yeong, Wai Yee

International journal of advanced manufacturing technology, 2018, Vol.94 (1-4), p.1309-1316 [Periódico revisado por pares]

London: Springer London

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9
Hybrid additive manufacture: Surface finishing methods for improving conductivity of inkjet printed tracks on non-planar substrates fabricated using fused deposition modeling
Material Type:
Artigo
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Hybrid additive manufacture: Surface finishing methods for improving conductivity of inkjet printed tracks on non-planar substrates fabricated using fused deposition modeling

Griffiths, Elliott R. ; Leigh, Simon J.

Sensors and actuators. A. Physical., 2022-01, Vol.333, p.113235, Article 113235 [Periódico revisado por pares]

Lausanne: Elsevier B.V

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10
Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors
Material Type:
Artigo
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Hybrid 3D Printing of Molten Metal Microdroplets and Polymers for Prototyping of Printed Circuit Boards Featuring Interdigitated 3D Capacitors

Khan, Zeba ; Gururajan, Dheepesh ; Koltay, Peter ; Kartmann, Sabrina ; Zengerle, Roland ; Shu, Zhe

IEEJ transactions on electrical and electronic engineering, 2024-05, Vol.19 (5), p.894-899 [Periódico revisado por pares]

Hoboken, USA: John Wiley & Sons, Inc

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