Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: magazinearticle
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Process improvement for 65Mn steel spring supportLiu, Y-YJīnshŭ rèchŭlĭ, 2002-10 (10), p.41-41Sem texto completo |
2 |
Material Type: magazinearticle
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Reason of formation, harmful effect and removal of band structure in low carbon alloy steelLiu, Y.-X.,--Jīnshŭ rèchŭlĭ, 2000-12, Vol.12, p.1-3Sem texto completo |
3 |
Material Type: magazinearticle
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Power structure optimization based on environmental constraintsShi, Y.-L. ; Liu, Y.-Y.Zhongguo dian li, 2009-09, Vol.42 (9), p.16-19Sem texto completo |
4 |
Material Type: magazinearticle
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Properties of QRO 90 Supreme hot working die steelShi, W ; Liu, YJīnshŭ rèchŭlĭ, 1997-01, Vol.1, p.25-28Sem texto completo |
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Material Type: magazinearticle
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Rational Use of the Continuous Gas Carburizing Automatic LineLiu, Y PJīnshŭ rèchŭlĭ, 1993-04, Vol.4 (188), p.29-31Sem texto completo |
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Material Type: magazinearticle
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Application of the automatic MIG aluminum bronze welding to the disjoined sliding railLiu, Y CYe jin she bei, 1993-04, Vol.2, p.41-43Sem texto completo |
7 |
Material Type: magazinearticle
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Introduction to the Water-Cooled Gear Box for the Bell-less Equipment of Bao Steel No. 2 BFLiu, Y TYe jin she bei, 1992-12, Vol.6 (76), p.17-20Sem texto completo |
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Material Type: magazinearticle
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Study on the Heat Treatment and Polishing Property of P20 Plastics Mold SteelLiu, Y ; Zhang, BJīnshŭ rèchŭlĭ, 1991-11 (11), p.32Sem texto completo |
9 |
Material Type: magazinearticle
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Improving Brittleness of Boride Layer of 5CrMnMo Steel by Using Boron-ZirconizingLiu, Y ; Wang, XJīnshŭ rèchŭlĭ, 1990-04 (4), p.26-34Sem texto completo |
10 |
Material Type: magazinearticle
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The Impact of the Electrode Performance on the Endurance Properties of the Phase Change Memory DeviceLu, Y. Y. ; Cai, D. L. ; Chen, Y. F. ; Zheng, Y. H. ; Yan, S. ; Wu, L. ; Liu, Y. G. ; Li, Y. ; Song, Z. T.IEEE transactions on device and materials reliability, 2019-03, Vol.19 (1), p.164-168 [Periódico revisado por pares]New York: IEEETexto completo disponível |