Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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The effect of oxygen in Ru gate electrode on effective work function of Ru/HfO2 stack structureNABATAME, T ; SEGAWA, K ; KADOSHIMA, M ; TAKABA, H ; IWAMOTO, K ; KIMURA, S ; NUNOSHIGE, Y ; SATAKE, H ; OHISHI, T ; TORIUMI, AkiraMaterials science in semiconductor processing, 2006-12, Vol.9 (6), p.975-979 [Periódico revisado por pares]Oxford: Elsevier ScienceTexto completo disponível |
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2 |
Material Type: Artigo
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Optical properties of excitons in ZnO-based quantum well heterostructuresMakino, T ; Segawa, Y ; Kawasaki, M ; Koinuma, HSemiconductor science and technology, 2005-04, Vol.20 (4), p.S78-S91 [Periódico revisado por pares]IOP PublishingTexto completo disponível |
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3 |
Material Type: Artigo
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Realization of one-chip-two-wavelength light sourcesSong, J.S. ; Cho, M.W. ; Oh, D.C. ; Makino, H. ; Hanada, T. ; Zhang, B.P. ; Segawa, Y. ; Song, H.S. ; Cho, I.S. ; Chang, J.H. ; Yao, T.Materials science in semiconductor processing, 2003-10, Vol.6 (5), p.561-565 [Periódico revisado por pares]Elsevier LtdTexto completo disponível |
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4 |
Material Type: Ata de Congresso
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Fabrication of fine wiring structure by electrodeposited polyimide for high density packaging and interconnectionTokoro, K. ; Nakagawa, H. ; Kikuchi, K. ; Eun-Sil Jung ; Segawa, S. ; Itatani, H. ; Aoyagi, M.4th Electronics Packaging Technology Conference, 2002, 2002, p.361-365IEEETexto completo disponível |
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5 |
Material Type: Ata de Congresso
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Fragile porous low-k/copper integration by using electro-chemical polishingTakahashi, S. ; Tai, K. ; Ohtorii, H. ; Komai, N. ; Segawa, Y. ; Horikoshi, H. ; Yasuda, Z. ; Yamada, H. ; Ishihara, M. ; Nogami, T.2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303), 2002, p.32-33Piscataway NJ: IEEETexto completo disponível |
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6 |
Material Type: Ata de Congresso
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New complementary PVD-Ta/CVD-WN stacked barrier structure for copper metallizationKaori Tai ; Ohtorii, H. ; Takahashi, S. ; Komai, N. ; Horikoshi, H. ; Sato, S. ; Ohoka, Y. ; Segawa, Y. ; Ishihara, M. ; Yasuda, Z. ; Nogami, T.Proceedings of the IEEE 2002 International Interconnect Technology Conference (Cat. No.02EX519), 2002, p.194-196IEEETexto completo disponível |