Silicon micro-channel definition via ICP plasma etching process using different hard masks
Hugo da S. Alvarez J. A Diniz; C. S Ruiz; Audrey R Silva; Frederico H Cioldin; Valter Salles do Nascimento Junior; AVS International Symposium and Exhibition (66. : 2019 : Columbus, Ohio, USA)
Abstract Book New York, NY, USA : AVS, 2019
New York, NY, USA AVS 2019
Localização:
EESC - Esc. Engenharia de São Carlos
(PROD-026260 )(Acessar)
A tattoo-inspired electrosynthesized polypyrrole film crossing the line toward a highly adherent film for biomedical implant applications
M. H. R. Borges B. E Nagay; R. C Costa; C. M Sacramento; K. G Ruiz; R Landers; J. J. J. P Van den Beucken; Carlos Alberto Fortulan; Elidiane Cipriano Rangel; N. C. da Cruz; V. A. R Barão
Materials Today Chemistry Oxford, United Kingdom : Elsevier, 2022 v. 26, article 101095, p. 1-18, Dec. 2022
Oxford, United Kingdom Elsevier 2022
Localização:
EESC - Esc. Engenharia de São Carlos
(PROD-025174 )(Acessar)
Automatic selection of color channels for segmentation of aerial images with photometric variations
Lúcio André de Castro Jorge Ednaldo José Ferreira; Henrique de Souza Ruiz; Valentin Obac Roda; Adilson Gonzaga; Workshop on Photometric Analysis for Computer Vision (2007 Rio de Janeiro)
Rio de Janeiro, 2007
Rio de Janeiro 2007
Localização:
EESC - Esc. Engenharia de São Carlos
(PROD-010835 )(Acessar)
Identifying the missing link between climate change policies and sectoral/ regional planning supported by Strategic Environmental Assessment in emergent economies lessons from Brazil
Boosting titanium surfaces with positive charges newly developed cationic coating combines anticorrosive and bactericidal properties for implant application
Joao Pedro dos Santos Silva Raphael C Costa; Bruna E Nagay; Maria H. R Borges; Catharina M Sacramento; Nilson Cristino da Cruz; Elidiane Cipriano Rangel; Carlos Alberto Fortulan; José H. D Silva; Karina Gonzales Silvério Ruiz; Valentim Adelino Ricardo Barão
ACS Biomaterials Science and Engineering Washington, DC, 2023 v. 9, n. 9, p. 5389-5404, 2023
Washington, DC 2023
Localização:
EESC - Esc. Engenharia de São Carlos
(PROD-026262 )(Acessar)