Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
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1 |
Material Type: Artigo
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Exact moment matching model of transmission lines and application to interconnect delay estimationQingjian Yu ; Kuh, E.S.IEEE transactions on very large scale integration (VLSI) systems, 1995-06, Vol.3 (2), p.311-322 [Periódico revisado por pares]IEEETexto completo disponível |
2 |
Material Type: Artigo
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Predictive system shutdown and other architectural techniques for energy efficient programmable computationSrivastava, M.B. ; Chandrakasan, A.P. ; Brodersen, R.W.IEEE transactions on very large scale integration (VLSI) systems, 1996-03, Vol.4 (1), p.42-55 [Periódico revisado por pares]Piscataway, NJ: IEEETexto completo disponível |
3 |
Material Type: Artigo
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VLSI implementation of a focal plane image processor-a realization of the near-sensor image processing conceptEklund, J.-E. ; Svensson, C. ; Astrom, A.IEEE transactions on very large scale integration (VLSI) systems, 1996-09, Vol.4 (3), p.322-335 [Periódico revisado por pares]IEEETexto completo disponível |
4 |
Material Type: Artigo
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Protocol selection and interface generation for HW-SW codesignDaveau, J.-M. ; Marchioro, G.F. ; Ben-Ismail, T. ; Jerraya, A.A.IEEE transactions on very large scale integration (VLSI) systems, 1997-03, Vol.5 (1), p.136-144 [Periódico revisado por pares]Piscataway, NJ: IEEETexto completo disponível |
5 |
Material Type: Artigo
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A solution methodology for exact design space exploration in a three-dimensional design spaceChaudhuri, S. ; Blthye, S.A. ; Walker, R.A.IEEE transactions on very large scale integration (VLSI) systems, 1997-03, Vol.5 (1), p.69-81 [Periódico revisado por pares]Piscataway, NJ: IEEETexto completo disponível |
6 |
Material Type: Artigo
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Power analysis and minimization techniques for embedded DSP softwareMike Tien-Chien Lee ; Tiwari, V. ; Malik, S. ; Fujita, M.IEEE transactions on very large scale integration (VLSI) systems, 1997-03, Vol.5 (1), p.123-135 [Periódico revisado por pares]Piscataway, NJ: IEEETexto completo disponível |
7 |
Material Type: Artigo
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Electro-thermal and logi-thermal simulation of VLSI designsSzekely, V. ; Poppe, A. ; Pahi, A. ; Csendes, A. ; Hajas, G. ; Rencz, M.IEEE transactions on very large scale integration (VLSI) systems, 1997-09, Vol.5 (3), p.258-269 [Periódico revisado por pares]Piscataway, NJ: IEEETexto completo disponível |
8 |
Material Type: Artigo
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Electro-thermal circuit simulation using simulator couplingWunsche, S. ; Clauss, C. ; Schwarz, P. ; Winkler, F.IEEE transactions on very large scale integration (VLSI) systems, 1997-09, Vol.5 (3), p.277-282 [Periódico revisado por pares]Piscataway, NJ: IEEETexto completo disponível |
9 |
Material Type: Artigo
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Graded-channel MOSFET (GCMOSFET) for high performance, low voltage DSP applicationsJun Ma ; Han-Bin Liang ; Pryor, R.A. ; Cheng, S. ; Kaneshiro, M.H. ; Kyono, C.S. ; Papworth, K.IEEE transactions on very large scale integration (VLSI) systems, 1997-12, Vol.5 (4), p.352-359 [Periódico revisado por pares]Piscataway, NJ: IEEETexto completo disponível |
10 |
Material Type: Artigo
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Intrinsic MOSFET parameter fluctuations due to random dopant placementXinghai Tang ; De, V.K. ; Meindl, J.D.IEEE transactions on very large scale integration (VLSI) systems, 1997-12, Vol.5 (4), p.369-376 [Periódico revisado por pares]Piscataway, NJ: IEEETexto completo disponível |