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Chalcogenides
| Result Number | Material Type | Add to My Shelf Action | Record Details and Options |
|---|---|---|---|
| 1 |
![Increased transition temperature in [ital in] [ital situ] coevaporated YBa[sub 2]Cu[sub 3]O[sub 7[minus][delta]] thin films by low temperature post-annealing](../images/pixel.png){kind=tracking}
Material Type: Article
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Increased transition temperature in [ital in] [ital situ] coevaporated YBa[sub 2]Cu[sub 3]O[sub 7[minus][delta]] thin films by low temperature post-annealingBerkowitz, S.J. ; De Obaldia, E. ; Ludwig, K.F. Jr ; Skocpol, W.J. ; Mankiewich, P.M. ; Ono, R.H. ; Beall, J.A. ; Vale, L.R. ; Rudman, D.A. ; O'Malley, M.L. ; Drabeck, L.M. ; Polakos, P.A.Applied physics letters, 1994-09, Vol.65:12 [Peer Reviewed Journal]United StatesFull text available |
| 2 |
Material Type: Article
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Insulating nanoparticles on YBa[sub 2]Cu[sub 3]O[sub 7[minus][delta]] thin films revealed by comparison of atomic force and scanning tunneling microscopyThomson, R.E. ; Moreland, J. ; Missert, N. ; Rudman, D.A. ; Sanders, S.C. ; Cole, B.F.Applied physics letters, 1993-08, Vol.63:5 [Peer Reviewed Journal]United StatesFull text available |
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Material Type: Article
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Increased pinning energies and critical current densities in heavy-ion-irradiated Bi[sub 2]Sr[sub 2]CaCu[sub 2]O[sub 8] single crystalsCutro, J.A. ; Rudman, D.A. ; Orlando, T.P. ; van Dover, R.B. ; Schneemeyer, L.F. ; White, A.E. ; Gyorgy, E.M. ; Waszczak, J.V. ; Felder, R.J.Applied physics letters, 1993-02, Vol.62:7 [Peer Reviewed Journal]United StatesFull text available |
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Material Type: Article
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YBa sub 2 Cu sub 3 O sub 7 minus x to Si interconnection for hybrid superconductor/ semiconductor integrationHarvey, T.E. ; Moreland, J. ; Jeanneret, B. ; Ono, R.H. ; Rudman, D.A.Applied physics letters, 1992-11, Vol.61:18 [Peer Reviewed Journal]United StatesFull text available |
| 5 |
Material Type: Article
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Scanning tunneling microscopy of the surface morphology of YBa sub 2 Cu sub 3 O sub x thin films between 300 and 76 KMoreland, J. ; Rice, P. ; Russek, S.E. ; Jeanneret, B. ; Roshko, A. ; Ono, R.H. ; Rudman, D.A.Applied physics letters, 1991-12, Vol.59:23 [Peer Reviewed Journal]United StatesFull text available |
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Material Type: Article
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High-T sub c Superconductor--Normal Metal--Superconductor Josephson Microbridges With High-Resistance Normal Metal LinksOno, R H ; Beall, J A ; Cromar, M W ; Harvey, T E ; Johansson, M E ; Reintsema, C D ; Rudman, D AApplied physics letters, 1991-08, Vol.59 (9), p.1126-1128 [Peer Reviewed Journal]United StatesFull text available |
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Material Type: Conference Proceeding
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YBa sub 2 Cu sub 3 Co sub 7. delta. insulator multi-layers for crossover fabricationBeall, J.A. ; Cromar, M.W. ; Harvey, T.E. ; Johansson, M.E. ; Ono, R.H. ; Reintsema, C.D. ; Rudman, D.A. ; Asher, S.E. ; Nelson, A.J. Switzerlander, A.B.IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States), 1991, Vol.27:2United StatesFull text available |
| 8 |
Material Type: Conference Proceeding
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Properties of YBa sub 2 Cu sub 3 O sub 7 minus. delta. thin films grown on off-axis-cut MgO substratesRussek, S.E. ; Jeanneret, B. ; Rudman, D.A. ; Ekin, J.W.IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States), 1991, Vol.27:2United StatesFull text available |
| 9 |
Material Type: Article
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Grain alignment and transport properties of Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub 8 /grown by laser-heated float zone methodLuo, J. ; Jiang, X.P. ; Chow, H.M. ; Cima, M.J. ; Graybeal, J.M. ; Orlando, T.P. ; Rudman, D.A.IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States), 1991-03, Vol.27 (2), p.1499-1502United States: IEEEFull text available |
| 10 |
Material Type: Article
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The effects of anneal time and cooling rate on the formation and texture of Bi/sub 2/Sr/sub 2/CaCu/sub 2/O/sub 8/ filmsMatthiesen, M.M. ; Graybeal, J.M. ; Orlando, T.P. ; Vander Sande, J.B. ; Rudman, D.A.IEEE Transactions on Magnetics (Institute of Electrical and Electronics Engineers); (United States), 1991-03, Vol.27 (2), p.1223-1226United States: IEEEFull text available |
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