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Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study
Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study
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Damage mechanics of electromigration and thermomigration in lead-free solder alloys under alternating current: An experimental study

Yao, Wei ; Basaran, Cemal

International journal of damage mechanics, 2014-03, Vol.23 (2), p.203-221 [Periódico revisado por pares]

London, England: SAGE Publications

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A cyclic two-surface thermoplastic damage model with application to metallic plate dampers
A cyclic two-surface thermoplastic damage model with application to metallic plate dampers
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A cyclic two-surface thermoplastic damage model with application to metallic plate dampers

Kim, Dongkeon ; Dargush, Gary F. ; Basaran, Cemal

Engineering structures, 2013-07, Vol.52, p.608-620 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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3
Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model
Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model
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Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model

Yao, Wei ; Basaran, Cemal

Computational materials science, 2013-04, Vol.71, p.76-88 [Periódico revisado por pares]

Amsterdam: Elsevier B.V

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4
Low temperature electromigration and thermomigration in lead-free solder joints
Low temperature electromigration and thermomigration in lead-free solder joints
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Low temperature electromigration and thermomigration in lead-free solder joints

Basaran, Cemal ; Abdulhamid, Mohd F.

Mechanics of materials, 2009-11, Vol.41 (11), p.1223-1241 [Periódico revisado por pares]

Kidlington: Elsevier Ltd

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5
Thermomigration Versus Electromigration in Microelectronics Solder Joints
Thermomigration Versus Electromigration in Microelectronics Solder Joints
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Thermomigration Versus Electromigration in Microelectronics Solder Joints

Abdulhamid, M.F. ; Basaran, C. ; Yi-Shao Lai

IEEE transactions on advanced packaging, 2009-08, Vol.32 (3), p.627-635

Piscataway, NJ: IEEE

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6
Damage Mechanics of Low Temperature Electromigration and Thermomigration : Packaging for micro/nano-scale systems
Damage Mechanics of Low Temperature Electromigration and Thermomigration : Packaging for micro/nano-scale systems
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Damage Mechanics of Low Temperature Electromigration and Thermomigration : Packaging for micro/nano-scale systems

SHIDONG LI ; ABDULHAMID, Mohd F ; BASARAN, Cemal

IEEE transactions on advanced packaging, 2009, Vol.32 (2), p.478-485

Piscataway, NJ: Institute of Electrical and Electronics Engineers

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7
Simulating Damage Mechanics of Electromigration and Thermomigration
Simulating Damage Mechanics of Electromigration and Thermomigration
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Simulating Damage Mechanics of Electromigration and Thermomigration

Shidong Li ; Abdulhamid, Mohd F. ; Basaran, Cemal

Simulation (San Diego, Calif.), 2008-08, Vol.84 (8-9), p.391-401 [Periódico revisado por pares]

London, England: SAGE Publications

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8
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging
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Influence of Interfacial Compliance on Thermomechanical Stresses in Multilayered Microelectronic Packaging

Basaran, C. ; Yujun Wen

IEEE transactions on advanced packaging, 2006-11, Vol.29 (4), p.666-673

Piscataway, NY: IEEE

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9
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm
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Damage mechanics constitutive model for Pb/Sn solder joints incorporating nonlinear kinematic hardening and rate dependent effects using a return mapping integration algorithm

Gomez, Juan ; Basaran, Cemal

Mechanics of materials, 2006-07, Vol.38 (7), p.585-598 [Periódico revisado por pares]

Lausanne: Elsevier Ltd

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10
A thermodynamic model for electrical current induced damage
A thermodynamic model for electrical current induced damage
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A thermodynamic model for electrical current induced damage

Basaran, C. ; Minghui Lin ; Hua Ye

2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546), 2004, Vol.2, p.1738-1745 Vol.2

Piscataway NJ: IEEE

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