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Material Type: Livro
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Material Type: Livro
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Material Type: Livro
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Material Type: Livro
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Material Type: Livro
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Reflow Soldering Processes and Troubleshooting : SMT, BGA, CSP and Flip Chip TechnologiesNing-Cheng LeeBurlington Newnes 2001Acesso online |
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Material Type: Livro
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Memory Construction and the Politics of Time in Neoliberal South KoreaNamhee LeeDuke University Press 2022Acesso online |
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Material Type: Livro
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Innovation for the Masses : How to Share the Benefits of the High-Tech EconomyNeil. LeeBerkeley University of California Press 2024Acesso online |
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Material Type: Livro
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